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China Material Technology Co., Ltd.

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sputtering target ito (bonding cu)99.99% virtual p
sputtering target ito (bonding cu)99.99% virtual p
Specification: Size 01: diameter <360mm thickness> 1 mm (wafer / round table /
Detail: Physical properties Color Gray Density 7.14g/ml Melting point 1500-1900 Technical indicators purity 99.99% Relative density >99% Cut surface flatness 3.2Ra Tolerance ±0.1mm grain ...
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